Vapor-Chamber Technology
Based on the successful experience with our Toxic line using Vapor Chamber coolers, SAPPHIRE introduces the new Vapor-X graphics card series to bring users a silent and efficient cooling solution based on Vapor Chamber technology. With such an efficient cooling system, the Vapor-X series has more potential in overclocking and longer life expectancy.
Vapor Chamber Technology is based on the same principles as heatpipe technology.
A liquid coolant is vaporised at a hot surface, the resulting vapor is condensed at a cold surface then the liquid is returned to the hot surface. The recirculation process is controlled by a patented wick system.
The patented complex wick system at the heart of Vapor-X:
SAPPHIRE Vapor-X flattens the whole system into a slim chamber - which in the graphics application is mounted in contact with the surface of the graphics chip.
How does Vapor Chamber work?
- Heat source heats Vaporization Wicks
- Working fluid, pure water, is easily vaporized due to the extreme low pressure (<104 Tor or less)
- Water vapor moves easily through the vacuum until
- It meets the Condensing Wick – adjacent to the cooled surface - and turns back to a liquid state
- The liquid is then absorbed by the Transportation Wick by capillary action and moved back towards the Vaporization Wick
- The recycled liquid is then reheated and re-vaporized by the Vaporization Wick and the process repeats.
Innovative Black Diamond Choke
The Choke is an important component of the graphics card. By working with the component engineer, Sapphire’s patent pending choke is 10% cooler and offers 25% more power efficiency than a normal choke.
The graphics card will be more reliable and save energy.
Full Solid Cap Design
Improved reliability and better overclocking are possible by using only high-polymer, aluminum capacitors which posses far superior characteristics than regular aluminum capacitor for a longer product life.
When operational temperatures drop by 20 C, the product life span is extended by a factor of ten, when the operational temperature increases by 20 C, the product life span only decreases by 10%.
