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AMD RYZEN 3000-SERIES

June 04, 2019

AMD, RYZEN

AMD RYZEN 3000-SERIES

AMD Announces Next-Generation Leadership Products at Computex 2019 Keynote

AMD (NASDAQ: AMD) made technology history with the announcement of high-performance 7nm-based computing and graphics products that are expected to deliver new levels of performance, features and experiences for PC gamers, enthusiasts and content creators. During the first-ever Computex opening keynote, AMD President and CEO Dr. Lisa Su announced:

  • The new “Zen 2” core widely outperforms the historical generational performance improvement industry trend, up to 15% estimated instructions per clock (IPC)2 uplift over the predecessor “Zen” architecture. The “Zen 2” CPU core powering the next-generation AMD Ryzen and EPYC™ processors also includes significant design improvements including larger cache sizes and a redesigned floating point engine.
  • The 3rd Gen AMD Ryzen desktop processor family, including the new 12-core Ryzen 9 processor, offers leadership performance.1
  • The AMD X570 chipset for socket AM4, the world’s first PCIe 4.0 supported chipset with more than 50 new motherboards at launch.
  • RDNA gaming architecture designed to drive the future of PC gaming, console, and cloud, anticipated to deliver incredible performance, power, and memory efficiency in a smaller package.
  • The 7nm AMD Radeon RX 5700-series gaming graphics card family featuring high-speed GDDR6 memory and support for the PCIe 4.0 interface.

Dr. Su was joined by fellow technology leaders Microsoft Corporate Vice President of OS Platforms Roanne Sones, Asus Chief Operating Officer Joe Hsieh, Acer Co-Chief Operating Officer Jerry Kao and a host of other significant industry players to showcase the breadth and depth of the AMD high-performance computing and graphics ecosystem.

“2019 is off to an incredible start for AMD as we celebrate 50 years of innovation by delivering leadership products to push the limits of what is possible with computing and graphics technology,” said Dr. Su. “We made significant strategic investments in next-generation cores, a breakthrough chiplet design approach, and advanced process technologies to deliver leadership 7nm products to our high-performance computing ecosystem. We are extremely excited to kick-off Computex 2019 together with our industry partners as we prepare to bring our next generation of Ryzen desktop and EPYC server processors and Radeon RX gaming graphics cards to market.” 

AMD High-Performance Desktop Updates

Continuing its path of PC leadership and industry firsts, AMD announced the 3rd Gen AMD Ryzen desktop processor, the most advanced desktop processor in the world3 with ground-breaking performance across gaming, productivity, and content creation applications. Based on the new “Zen 2” core architecture with AMD chiplet design approach, 3rd Gen AMD Ryzen desktop processors are expected to offer more performance-critical on-die cache than ever before to unleash elite gaming performance. Additionally, all 3rd Gen Ryzen desktop processors are supported by the world’s first PCIe 4.0 PC readiness for the most advanced motherboards, graphics, and storage technologies available, setting a new standard of performance and providing the ultimate consumer experience.

With the 3rd Gen AMD Ryzen desktop processor family, AMD introduced a new category of Ryzen 9 desktop processor with the flagship 12 core/24 thread Ryzen 9 3900X. Pushing the high-performance envelope for socket AM4 by offering leadership performance1, the family is rounded out with 8 core Ryzen 7 models and 6 core Ryzen 5 models.

3rd Gen AMD Ryzen Desktop Processor Line-up

Model Cores/ Threads TDP7 (Watts) Boost/Base Freq. (GHz) Total Cache (MB) PCIe4.0 Lanes (processor+AMD X570)
Ryzen™ 9 3900X CPU 12/24 105W 4.6/3.8 70 40
Ryzen™ 7 3800X CPU 8/16 105W 4.5/3.9 36 40
Ryzen™ 7 3700X CPU 8/16 65W 4.4/3.6 36 40
Ryzen™ 5 3600X CPU 6/12 95W 4.4/3.8 35 40
Ryzen™ 5 3600 CPU 6/12 65W 4.2/3.6 35 40

AMD also introduced a new X570 chipset for socket AM4, supporting the world’s first PCIe 4.0 readiness, which exhibited 42% faster storage performance than PCIe 3.09, enabling high-performance graphics card, networking devices, NVMe drives, and more. With PCIe 4.0 doubling the bandwidth for motherboards with the X570 chipset over PCIe 3.0, PC enthusiasts can gain more performance and flexibility when building custom systems. The X570 offers the broadest ecosystem readiness in AMD history, with over 50 new motherboard models anticipated from ASRock, Asus, Colorful, Gigabyte, MSI, as well as PCIe 4.0 storage solutions from partners including Galaxy, Gigabyte, and Phison. The 3rd Gen AMD Ryzen desktop processors are expected to be available for purchase globally on July 7, 2019.

>>Source

1.Testing by AMD Performance Labs as of 05/26/2019 utilizing the Ryzen 9 3900X vs. Core i9-9920X in Cinebench R20 nT. Results may vary. RZ3-13

2.Testing by AMD Performance Labs as of 5/23.2918 AMD “Zen2” CPU-based system scored an estimated 15% higher than previous generation AMD “Zen” based system using estimated SPECint®_rate_base2006 results. SPEC and SPECint are registered trademarks of the Standard Performance Evaluation Corporation. See www.spec.org. GD-141

3.“Advanced” defined as superior process technology in a smaller node and unique support for PCIe® Gen 4 in the gaming market as of 05/26/2019. RZ3-14

7.Though both are often measured in watts, it is important to distinguish between thermal and electrical watts. Thermal wattage for processors is conveyed via thermal design power (TDP). TDP is a calculated value that conveys an appropriate thermal solution to achieve the intended operation of a processor. Electrical watts are not a variable in the TDP calculation. By design, electrical watts can vary from workload to workload and may exceed thermal watts. GD-109

9.Testing as of 05/20/2019 by AMD Performance Labs using a 3rd Gen AMD Ryzen™ Processor in Crystal DiskMark 6.0.2. Results may vary with configuration. RZ3-12 

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